NAMICS Corporation

1988

Raymond Dietz

Located in Byfield, Massachusetts, 30 miles north of Boston

Diemat specializes in the development and manufacturing of innovative adhesive and sealing materials to serve the electronic packaging industry. As a technology driven company, only patentable products are marketed. This group has developed a broad range of unique products, none of which have equivalents on the market.

http://www.diemat.com

Diemat, Inc. was founded in 1988 by Raymond Dietz

Located in Byfield, Massachusetts, 30 miles north of Boston

Mr. Diez has over 40 years of experience in the electronic materials industry serving in different capacities of development, marketing, and general management. Mr. Dietz is the holder of over 25 patents in this field.

Diemat specializes in the development and manufacturing of innovative adhesive and sealing materials to serve the electronic packaging industry. As a technology driven company, only patentable products are marketed. This group has developed a broad range of .unique products, none of which have equivalents on the market.

Developed a lower temperature (300°C) Ag loaded glass adhesive for die attachment.

Patented a thermoplastic Ag adhesives offering thermal conductivity that is an order of magnitude greater than the prior art.

Developed a low temperature, solder-glass preform for hermetically sealing optical fibers in optoelectronic packages.

Diemat was acquired by Namics Corporation.